Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) has developed a new electronics packaging technology platform with improved electrical, thermal and reliability performance for key power conversion modules in data centres and telecommunication equipment.
As effort to address the challenges of supplying ever increasing computing power using less energy in a smaller space with mission-critical reliability, ASTR has developed a new technology platform using Vertical-Driver-GaN and Package-Embedded Inductor technologies to improve the power density and the coupled electromagnetic-thermal performance concurrently for the critical power conversion modules in the next-generation data centres and telecommunication equipment.
Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong’s competitiveness through applied research. ASTRI’s core R&D competence in various areas is grouped under four Technology Divisions: Trust and AI Technologies; Communications Technologies; IoT Sensing and AI Technologies and Integrated Circuits and Systems. It is applied across six core areas which are Smart City, Financial Technologies, New-Industrialisation and Intelligent Manufacturing, Digital Health, Application Specific Integrated Circuits and Metaverse.